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In the autumn of this year, it is expected that the launch of the Apple iPhone and iPhone phones 6s 6s Plus. Until then, I will not calm down phones new rumors concerning Apple. Where one of the persons within the supply chain for Babylon leaking pictures of what purported to have been the next generation of iPhone models. According own internal part images of the temple, that Apple will use the new assembly points in the motherboard. This is in line with previous reports which indicated that Apple will use a combination of SiP technology and technical PCB models next iPhone, before you completely dismiss PCB technology in iPhone devices in 2016.
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